Dongguan Debailong Electronic Technology Co., Ltd.

1, content of tin solder is too low, do not meet the welding requirements, you need to replace the standard, solder better quality. Inferior solder market usually posing as component. 2, solder PC plate welding time is not enough or the solder operation temperature is not enough, the solder welding temperature greater than the melting temperature above 60 degrees. The 3 part, the metal pad on the circuit board of the oxidation phenomenon can also cause bad tin. Only clean off the oxide layer or the circuit board for suppliers to solve. 4, the pad is attached to the surface of PC in the manufacturing process of grinding particles left behind, a variety of terminal or oil impurities should first clean the surface of pad. 5, the flux conditions such as improper adjustment, adjust the air compressor and the foaming height of the foam nozzle flux improper; improper adjustment. 6, preheating temperature is not enough: to adjust the preheating temperature, the substrate is zero The temperature of the side surface of the workpiece reaches the working temperature of the welding. The above six cases are the more common phenomenon in the production, and there are many reasons for the solder paste not good. The specific conditions can only be analyzed in detail